Laird Tflex™ HD90000 Thermal Gap Filler

  • Introduction

    Tflex™ HD90000 combines 7.5W/m·K thermal conductivity with superior pressure versus deflection characteristics.The combination will allow minimal stress on components while also yielding low thermal resistance.

  • Model

    Tflex™ HD90000

  • Sub-Packaging Specs

    Thickness:0.5mm / 1.0mm / 1.5mm / 2.0mm / 2.5mm


    Dimension:15*85mm*2 / 40*80mm / 100*100mm

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Tflex™ HD90000 combines 7.5 W/m·K thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device.