DOWSIL TC-5888 Thermal Grease

  • Introduction

    DOWSIL TC-5888 is thermally conductive compound with a thermal conductivity of 5.2W/m·K,which can achieve a minimum bondline thickness of about 20μm,thus achieving an ultra-low thermal resistance of 0.05℃·cm²/W.

  • Model

    TC-5888

  • Sub-Packaging Specs

    1g / 2g / 3g / 5g / 7g

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DOWSIL™ TC-5888 thermally conductive compounds are grease like materials that are highly loaded with thermally conductive fillers in a silicone matrix. This combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from an electrical device or PCB system assembly to a heat sink or chassis, thereby increasing the overall efficiency of the device. PCB system assemblies are continually designed to deliver higher performance.