Techinno Fill-Pad LV800 thermal pad has characteristics such as ultra soft, low volatility, and high deformation under low pressure. It has a high thermal conductivity of 8.0W/m.K and is suitable for applications that require polymorphic tolerances.
This product generates very weak or even negligible rebound stress while filling gaps of different sizes, which can greatly reduce the impact on precision electronic components. The unique formulation design gives it good interfacial wettability, thermal conductivity, and excellent mechanical properties, making it suitable for various application environments without failure due to pressure and temperature fluctuations.
As a reliable supplier in the thermal conductive material industry, we insist on providing customers with high-quality products and better user experience.
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Techinno Gel800 Thermal Putty
